简介

陈志文，武汉大学集成电路学院教师，硕导、博导，国家级高层次人才青年项目、湖北省杰青、电子制造与封装集成湖北省重点实验室副主任，刘胜院士课题组教师，主要从事芯片先进封装及可靠性研究。发表包括Nature Communications在内的学术论文60余篇，获批发明专利8项（其中美国专利1项）、PCT 2项、软件著作权1项；主持科技部重点研发计划课题1项、国家自然科学基金项目2项、广东省自然科学基金面上项目1项；主持/参与其他纵向/横向项目共计13项。

2026年本人研究生招生指标如下，欢迎感兴趣的同学加QQ 276733629联系：

硕士：学术学位硕士2名，专业学位硕士2名（含卓工专项1名）；

博士：学术学位博士1名，专业学位博士1名。

主要兼职

（1）副主任，电子制造与封装集成湖北省重点实验室；

（2）召集人，全国微机电标委会 MEMS 仿真与数字孪生标准化工作组；

（3）青年编委，《Rare Metals》、《Microsystems & Nanoengineering》；

（4）3 次担任国际学术会议分会主席，International Conference on Electronic Packaging Technology（ICEPT）；

（5）3 次担任国际会议技术委员会成员,International Conference on Electronic Packaging Technology（ICEPT）。

代表性论文

1. Enhanced microstructure and mechanical property of large-area nano-Ag joints by porous Cu foam at low temperature, Journal of Alloys and Compounds, Vol. 1021, 2025, 179696-1-179696-9;

2. Spontaneous bifacial capping of perovskite film for efficient and mechanically stable flexible solar cell, Nature Communications, 2025, 16;

3. Mechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations, Intermetallics, Vol. 172, 2024, 108387;

4.  Impacts of pressure on the stability of chip stack structures in the presence of non-coplanar Cu pillars, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 14, NO. 7, 2024, pp. 1207-1214;

5.  Effects of Ag shell on electrical, thermal and mechanical properties of Cu@Ag composite solder preforms by electromagnetic compaction for power electronics, Materials Characterization, Vol. 197, 2023, pp. 112702-1-112702-9;

6. Effects of temperatures on microstructure evolution and deformation behavior of Fe-32Ni by in-situ EBSD, Materials Science and Engineering: A, Vol. 875, 2023, pp. 145097-1-145097-11;

7.Challenges and prospects for advanced packaging, Fundamental Research, Vol. 4, NO. 6, 2024, pp. 1455-1458;

8.Creep behavior of intermetallic compounds at elevated temperatures and its effect on fatigue life evaluation of Cu pillar bumps, Intermetallics, Vol. 144, 2022, pp. 107526-1-107526-8;

9. Interfacial reaction between Sn-Ag solder and electroless Ni-Fe-P diffusion barriers with different internal microstructure, Materials Research Bulletin, Vol. 152, 2022, pp. 111854- 1-111854-7;

10. Warpage characterization of a large size fan-out panel subjected to inhomogeneous heating by a digital fringe projection system, Microelectronics Reliability, Vol. 139, 2022, pp. 114818-1-114818-9；

11. Deformation measurement in Al thin films at elevated temperatures by digital image correlation with speckles prepared by femtosecond laser, Optics & Laser Technology, Vol. 155, 2022, pp. 108339-1-108339-10;

12. Mechanical performance and reliability of a Sn-Ag-Cu-Sb alloy at elevated temperatures, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 11, NO. 7, 2021, pp. 1081–1087;

13.Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics, Journal of Materials Processing Technology, Vol. 292, 2021, pp. 117056-1-117056-9;

14. A hybrid finite element modelling: artificial neural network approach for predicting solder joint fatigue life in wafer-level chip scale packages, Journal of Electronic Packaging, Vol. 143, NO. 1, 2021, pp. 011001-1-011001-8;

15. Influence of crystalline structure on diffusion barrier property of electroless Ni–Fe–P coatings in Zn-Al solder interconnects, Journal of Alloys and Compounds, Vol. 804, 2019, pp. 42-48;

主要报告

（1）邀请报告，MEMS 传感器先进封装测试平台，中国自动化学会中南六省自动化学会第40 届学术年会，2024 年11 月22 日-24 日，广西省南宁市；

（2）邀请报告，微小互连凸点的力学行为及变形机制，第26 届中国电子学会青年年会暨第五届半导体青年学术会议，2024 年11 月3 日-6 日，湖北省武汉市；

（3）邀请报告，微小互连凸点的力学行为及变形机制，中国科学院雁栖青年论坛集成电路三维制造技术与工艺专题论坛，2024 年10 月26 日-27 日，北京市；

（4）邀请报告，面向先进封装的互连结构微纳力学行为研究，2023 中国有色金属智库新能源材料论坛，2023 年10 月20 日-22 日，贵州省贵阳市；

（5）邀请报告, Analysis on the thermal stress of Al-Si thin film using DIC method, 2021 22nd International Conference on Electronic Packaging Technology （ICEPT）, 14-17 September 2021, Xiamen, Fujian。