• 其他栏目

    陈志文

    • 副教授 博士生导师 硕士生导师
    • 性别:男
    • 学历:博士研究生毕业
    • 联系方式:QQ:276733629
    • 电子邮箱:

    访问量:

    开通时间:..

    最后更新时间:..

    个人简介

    简介

    陈志文,副教授,武汉大学工业科学研究院,硕导、博导,湖北省杰青、电子制造与封装集成湖北省重点实验室副主任,刘胜院士课题组教师,主要从事芯片先进封装及可靠性研究。发表包括Nature Communications在内的学术论文60余篇,获批发明专利8项(其中美国专利1项)、PCT 2项、软件著作权1项;主持科技部重点研发计划课题1项、国家自然科学基金项目2、广东省自然科学基金面上项目1项;主持/参与其他纵向/横向项目共计13

    2026年本人招收研究生1名,欢迎感兴趣的同学加QQ 276733629联系。


    主要兼职

    1)副主任,电子制造与封装集成湖北省重点实验室

    2)召集人,全国微机电标委会 MEMS 仿真与数字孪生标准化工作组

    3)青年编委,《Rare Metals》、Microsystems & Nanoengineering

    43 次担任国际学术会议分会主席,International Conference on Electronic Packaging TechnologyICEPT

    53 次担任国际会议技术委员会成员,International Conference on Electronic Packaging TechnologyICEPT


    代表性论文

    1. Enhanced microstructure and mechanical property of large-area nano-Ag joints by porous Cu foam at low temperature, Journal of Alloys and Compounds, Vol. 1021, 2025, 179696-1-179696-9;

    2. Spontaneous bifacial capping of perovskite film for efficient and mechanically stable flexible solar cell, Nature Communications, 2025, 16;

    3. Mechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations, Intermetallics, Vol. 172, 2024, 108387;

    4.  Impacts of pressure on the stability of chip stack structures in the presence of non-coplanar Cu pillars, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 14, NO. 7, 2024, pp. 1207-1214;

    5.  Effects of Ag shell on electrical, thermal and mechanical properties of Cu@Ag composite solder preforms by electromagnetic compaction for power electronics, Materials Characterization, Vol. 197, 2023, pp. 112702-1-112702-9;

    6. Effects of temperatures on microstructure evolution and deformation behavior of Fe-32Ni by in-situ EBSD, Materials Science and Engineering: A, Vol. 875, 2023, pp. 145097-1-145097-11;

    7.Challenges and prospects for advanced packaging, Fundamental Research, Vol. 4, NO. 6, 2024, pp. 1455-1458;

    8.Creep behavior of intermetallic compounds at elevated temperatures and its effect on fatigue life evaluation of Cu pillar bumps, Intermetallics, Vol. 144, 2022, pp. 107526-1-107526-8;

    9. Interfacial reaction between Sn-Ag solder and electroless Ni-Fe-P diffusion barriers with different internal microstructure, Materials Research Bulletin, Vol. 152, 2022, pp. 111854- 1-111854-7;

    10. Warpage characterization of a large size fan-out panel subjected to inhomogeneous heating by a digital fringe projection system, Microelectronics Reliability, Vol. 139, 2022, pp. 114818-1-114818-9

    11. Deformation measurement in Al thin films at elevated temperatures by digital image correlation with speckles prepared by femtosecond laser, Optics & Laser Technology, Vol. 155, 2022, pp. 108339-1-108339-10;

    12. Mechanical performance and reliability of a Sn-Ag-Cu-Sb alloy at elevated temperatures, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 11, NO. 7, 2021, pp. 1081–1087;

    13.Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics, Journal of Materials Processing Technology, Vol. 292, 2021, pp. 117056-1-117056-9;

    14. A hybrid finite element modelling: artificial neural network approach for predicting solder joint fatigue life in wafer-level chip scale packages, Journal of Electronic Packaging, Vol. 143, NO. 1, 2021, pp. 011001-1-011001-8;

    15. Influence of crystalline structure on diffusion barrier property of electroless Ni–Fe–P coatings in Zn-Al solder interconnects, Journal of Alloys and Compounds, Vol. 804, 2019, pp. 42-48;


    主要报告

    1)邀请报告,MEMS 传感器先进封装测试平台,中国自动化学会中南六省自动化学会第40 届学术年会,2024 11 22 -24 日,广西省南宁市;

    2)邀请报告,微小互连凸点的力学行为及变形机制,第26 届中国电子学会青年年会暨第五届半导体青年学术会议,2024 11 -6 日,湖北省武汉市;

    3)邀请报告,微小互连凸点的力学行为及变形机制,中国科学院雁栖青年论坛集成电路三维制造技术与工艺专题论坛,2024 10 26 -27 日,北京市;

    4)邀请报告,面向先进封装的互连结构微纳力学行为研究,2023 中国有色金属智库新能源材料论坛,2023 10 20 -22 日,贵州省贵阳市;

    5)邀请报告, Analysis on the thermal stress of Al-Si thin film using DIC method, 2021 22nd International Conference on Electronic Packaging Technology ICEPT, 14-17 September 2021, Xiamen, Fujian