钻孔光学图像和雷达成像信息融合的裂缝参数提取方法
Date:2026-09-10
Hits:
- Affilication of Author(s):
- 武汉大学
- Patent Coverage:
- 0
- Disigner of the Invention:
- 韩增强,张明睿,孙涛,唐新建
- Type of Patent:
- 发明专利
- State of Patent:
- 已授权
- Application Number:
- CN108460419B
- Authorization number:
- ZL201810188144.2
- Service Invention or Not:
- yes
- Application Date:
- 2018-03-07
- Publication Date:
- 2018-08-28
- Authorization Date:
- 2020-05-08
- First Author:
- 李立