Personal Homepage
Home
Scientific Research
Research Field
Paper Publications
Patents
Published Books
Research Projects
Research Team
Teaching Research
Teaching Resources
Teaching Information
Teaching Achievement
Awards and Honours
Enrollment Information
Student Information
My Album
Blog
中文
张召富
Click:
The Last Update Time:
.
.
Open Time:
.
.
Location：
Home
>>Research Focus
先进封装工艺（2.5D/3D封装、Chiplet封装）的多物理场多尺度仿真与集成
先进封装工艺（2.5D/3D封装、Chiplet封装）的多物理场多尺度仿真与集成
